For the embedded DC / DC power supply on the large channel board, the interconnection impedance and propagation voltage drop of CB line are too low. The composition of DC voltage layer or DC voltage layer requires AC small signal line. In order to lose better voltage conditioning, load transient echo and fragmentation frequency, the power input is close to the load machine, P prevents the trouble of treble power line and power components. The demand between DC power supply and is placed on the ground power supply layer and small signal layer, and the DC power supply of heavy forced components (such as inductance and electrolytic storage capacity) is used as a barrier. To prevent the valve noise from disturbing the lax analog signal, it is required to prevent the passivated signal line from being placed in the power supply. There is a way to prevent the cyclone from passing through low nominal semi superconductor components, such as power MOSFET or PWM controller.
DC power supply for the embedded DC / DC power supply on the large channel board, in order to lose better voltage conditioning, load transient echo and fragmentation frequency, ensure outstanding atmospheric activities and limit thermal stress; If we can use forced gas cooling, the power input is close to the load machine, and the interconnection impedance and propagation voltage drop of PCB line are too low. We should keep the power close to the fan. For the embedded DC / DC power supply on large circuit board, in order to obtain better voltage conditioning, load transient response and system frequency, it is required to make the power output close to the load machine and reduce the interconnection impedance and voltage drop of PCB line. Current source is a deformation rule. The grounding layer or DC voltage level of Multilayer PCB should not be turned on.
Therefore, for passive components with large DC power supply, such as inductance and electrolytic capacitor, DC power supply can not be separated from the bottom plate of Multilayer PCB board or allowable current pressure layer as normal conditioning. In order to prevent switching music from disturbing the analog signal in the system, it should be possible to prevent the blunt signal line from being placed under the power supply; If not, it is required to set an internal layer as a resistance between the power layer and the small signal layer. Power management is considered to be an urgent mission. It is necessary to place the power supply on the path board at the necessary time. It is not necessary to stop the air flow to package semiconductor components, such as power MOSFET or PWM master, through the low surface. About high frequency, reliable power supply is very useless. Sometimes designers ignore this idea and focus on more important circuits, perhaps people on large system boards. The floor or allowable current pressure layer needs to close a barrier, small signal line and disturbance of power components from the high-noise power line. Ensure excellent air circulation and limit thermal stress; If forced air cooling is adopted, the power supply shall be placed on the fan side. Power management is considered to be the post mission of putting the power supply on the redundant work of the circuit board, which is very useful for high-frequency and reliable power design.
For the multi-layer pressing plate, the DC power supply needs to excessively reduce the unit and length of lines in the Department. In addition, the dispersion of pedestrian lines should be in the opposite direction to the large DC current, so as to reduce the response. Power management is considered to be an urgent mission. It is necessary to put the power on the access board at the necessary time. It is a good method to distribute DC or HVDC output / input voltage layer between the power weight layer of large DC power supply and the small signal jogging layer. The key of DC power supply is to plan the power supply orientation and the time required for access board. If this separation cannot be prevented, the high-frequency and reliable power supply is very useless. For multilayer laminates, it is a good method to distribute DC or HVDC output / input voltage layer between the power weight layer of large DC power supply and the small signal jogging layer. Sometimes, the dreamer will face this warning and ensure that the main or quieter passage is placed on a heavy plate. Sometimes designers ignore this idea and focus on more important circuits, perhaps on large systems.
