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Solar Battery Charger

A charger is a common charging device that converts electrical energy into DC energy and outputs the electrical energy to electronic devices such as cell phones, tablets, digital cameras, etc. through a USB cable that connects the charger to the electronic device, thus enabling the charging process. The charger does not require the use of a computer or other device to charge, it simply needs to be plugged into a wall outlet.

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Description

solar panel

Process of solar panel fabrication
10 steps including slicing, cleaning, preparing fleece surface, etching around, removing back side PN+ junction, making upper and lower electrodes, making anti-reflection film, sintering, testing and staging.
Solar cell specific production process description
(1) Slicing: Using multi-line cutting, silicon rods are cut into square silicon wafers.
(2) Cleaning: Cleaned with conventional silicon wafer cleaning methods, and then used acid (or alkali) solution to remove 30-50 um from the silicon wafer surface cutting damage layer.
(3) Preparation of suede: anisotropic etching of silicon wafers with alkali solution to prepare suede on the silicon wafer surface.
(4) Phosphorus diffusion: the use of coated sources (or liquid sources, or solid phosphorus nitride flake sources) for diffusion, made of PN + junction, junction depth is generally 0.3-0.5um.
(5) Peripheral etching: diffusion layer formed on the peripheral surface of the silicon wafer during diffusion will short circuit the upper and lower electrodes of the cell, remove the peripheral diffusion layer by masking wet etching or plasma dry etching.
(6) Removal of back PN+ junction. Commonly used wet etching or grinding method to remove the back PN+ junction.
(7) Make upper and lower electrodes: use vacuum vapor deposition, chemical nickel plating or aluminum paste printing and sintering processes. The lower electrode is made first, and then the upper electrode is made. Aluminum paste printing is the process method used in large quantities.
(8) Production of antireflection film: In order to reduce the incoming reflection loss, a layer of antireflection film is covered on the silicon wafer surface. The materials used to make the reflective film are MgF2, SiO2, Al2O3, SiO, Si3N4, TiO2, Ta2O5 and so on. Process methods can be vacuum coating method, ion coating method, sputtering method, printing method, PECVD method or spraying method, etc.
(9) Sintering: Sintering the battery chip on a nickel or copper substrate.
(10) Test staging: according to the prescribed parameters specification, test classification.